[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Power/ground noise coupling comparison and analysis in silicon, organic and glass interposers
Kim, Youngwoo, Cho, Kyungjun, Kim, Subin, Park, Gapyeol, Kim, JounghoYear:
2016
Language:
english
DOI:
10.1109/EDAPS.2016.7893112
File:
PDF, 1.56 MB
english, 2016