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[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Heat Transfer, Volume 3 - Thermal Enhancement of Stacked Dies Using Thermal Vias
Sung, Baekyoung, Chepuri, Krishnateja, Lee, Yongjie, Agonafer, Dereje, Agonafer, Damena, Amon, CristinaVolume:
2006
Year:
2006
Language:
english
DOI:
10.1115/imece2006-15352
File:
PDF, 785 KB
english, 2006