[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - An Arrhenius-type constitutive model to predict the deformation behavior in lead-free solders
Xiaoyan, Niu, Yingjie, Yu, Lianhua, Ma, Cong, ChenYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583261
File:
PDF, 1.00 MB
english, 2016