Low Temperature Solid State Gold Bonding of Si Chips to...

Journal of Electronic Packaging 2011 Vol. 133; Iss. 2

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Sha, Chu-Hsuan, Lee, Chin C.
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Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4003868
File:
PDF, 2.38 MB
english, 2011
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