Solder paste volume effects on assembly yield and...

Soldering & Surface Mount Technology 2017 / 04 Vol. 29; Iss. 2

Solder paste volume effects on assembly yield and reliability for bottom terminated components

Sriperumbudur, Sai Srinivas, Meilunas, Michael, Anselm, Martin
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Volume:
29
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-05-2016-0010
Date:
April, 2017
File:
PDF, 752 KB
english, 2017
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