[IEEE 2016 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Keynote address: Trends and challenges of high-frequency electromagnetic interference and protection with development of information communication technology (ICT)

Zhang, Yaojiang
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Year:
2016
DOI:
10.1109/EDAPS.2016.7893104
File:
PDF, 258 KB
2016
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