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Microelectronic Engineering 2017 / 4

High-aspect ratio nanopatterning via combined thermal scanning probe lithography and dry etching

Lisunova, Y., Spieser, M., Juttin, R.D.D., Holzner, F., Brugger, J.
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Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.04.006
Date:
April, 2017
File:
PDF, 855 KB
english, 2017
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