[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Assembly Process and Warpage Management of Large Size through Silicon Interposer (38.7mm × 26.7mm) Package
Chen, Zhaohui, Lin, Jong-Kai, Ding, Mian Zhi, Lim, Sharon Pei Siang, Zhang, XiaowuYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.151
File:
PDF, 343 KB
english, 2016