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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A study on the effect of aging on thermal cycling reliability of Sn-Ag-Cu interconnects using Digital Image Correlation
Lall, Pradeep, Mirza, Kazi, Suhling, JeffYear:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517592
File:
PDF, 6.67 MB
english, 2016