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[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - A high signal integrity interconnect design using a genetic algorithm and its solution analysis: What solution did GA find in time and frequency domain?
Matsuoka, Shumpei, Yasunaga, MoritoshiYear:
2016
Language:
english
DOI:
10.1109/EDAPS.2016.7893159
File:
PDF, 2.29 MB
english, 2016