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Cu seed layer damage caused by insoluble anode in Cu electrodeposition
Ham, Yu Seok, Cho, Sung Ki, Kim, Jae JeongVolume:
34
Language:
english
Journal:
Korean Journal of Chemical Engineering
DOI:
10.1007/s11814-017-0054-9
Date:
May, 2017
File:
PDF, 1.01 MB
english, 2017