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[IEEE 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2017.3.13-2017.3.17)] 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Thermal power envelope for IoT modules
Shipman, Jared A., Chigullapalli, Sruti, Mata, Jose, Martin, Thomas A.Year:
2017
Language:
english
DOI:
10.1109/SEMI-THERM.2017.7896914
File:
PDF, 786 KB
english, 2017