A Damage Mechanics-Based Fatigue Life Prediction Model for...

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Tang, Hong, Basaran, Cemal
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Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1536171
File:
PDF, 264 KB
english, 2003
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