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[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Modeling Thermal Spreading Resistance in Via Arrays
Fish, Michael, McCluskey, Patrick, Bar-Cohen, AvramYear:
2015
Language:
english
DOI:
10.1115/ipack2015-48422
File:
PDF, 2.12 MB
english, 2015