Confirmation of Creep and Fatigue Damage in Pb/Sn Solder...

Journal of Electronic Packaging 1992 Vol. 114; Iss. 2

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

Attarwala, A. I., Tien, J. K., Masada, G. Y., Dody, G.
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Volume:
114
Year:
1992
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2906405
File:
PDF, 888 KB
english, 1992
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