Microstructural Evolution and Mechanical Properties in...

Journal of Electronic Materials 2016 / 10 Vol. 45; Iss. 10

Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

Dong, Hongqun, Vuorinen, Vesa, Laurila, Tomi, Paulasto-Kröckel, Mervi
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Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4733-9
Date:
October, 2016
File:
PDF, 1.67 MB
english, 2016
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