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Dislocation density and mechanical threshold stress in OFHC copper subjected to SHPB loading and plate impact
Hu, Qiushi, Zhao, Feng, Fu, Hua, Li, Kewu, Liu, FushengVolume:
695
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2017.03.112
Date:
May, 2017
File:
PDF, 7.10 MB
english, 2017