[IEEE 2016 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - SMPS noise managing methodology for RFI solution in mobile platforms

Kim, Kiyeong, Baek, Hyunho, Shim, Hwan-woo, Yu, Jiheon, Scogna, Antonio Ciccomancini, Kim, Dong-Sub
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Year:
2016
Language:
english
DOI:
10.1109/EDAPS.2016.7893115
File:
PDF, 2.28 MB
english, 2016
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