The Application of Moldflow in Injection Mold Design of Mobile Phone Cover
Zhang, Wen Jian, Zhang, QiVolume:
228-229
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.228-229.542
Date:
April, 2011
File:
PDF, 358 KB
english, 2011