Thermoelastic Properties of Plain Weave Composites for...

Journal of Electronic Packaging 1999 Vol. 121; Iss. 1

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

Sottos, N. R., Ockers, J. M., Swindeman, M.
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Volume:
121
Year:
1999
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792659
File:
PDF, 869 KB
english, 1999
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