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Microstructural and component evolution of self-assembled nanoperiod multilayered carbon-copper films with deposition pressure
Wang, Weiqi, Ji, Li, Li, Hongxuan, Zhao, Yiman, Zhou, Huidi, Chen, JianminVolume:
7
Language:
english
Journal:
AIP Advances
DOI:
10.1063/1.4980056
Date:
April, 2017
File:
PDF, 7.78 MB
english, 2017