Thermal decomposition of solder flux activators under...

Soldering & Surface Mount Technology 2017 / 06 Vol. 29; Iss. 3

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Piotrowska, Kamila, Jellesen, Morten Stendahl, Ambat, Rajan
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Volume:
29
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-01-2017-0003
Date:
June, 2017
File:
PDF, 1.82 MB
english, 2017
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