[ASME ASME 2005 International Mechanical Engineering Congress and Exposition - Orlando, Florida, USA (November 5 – 11, 2005)] Microelectromechanical Systems - Packaging of In-Plane Thermal Microactuators for BioMEMS Applications
Panchawagh, Hrishikesh V., Faheem, Faheem F., Herrmann, Cari F., Serrell, David B., Finch, Dudley S., Mahajan, Roop L.Volume:
2005
Year:
2005
Language:
english
DOI:
10.1115/IMECE2005-82528
File:
PDF, 672 KB
english, 2005