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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices
Singh, Randeep, Akbarzadeh, Aliakbar, Mochizuki, Mastaka, Saito, Yuji, Nguyen, Thang, Kao, Bob, Sataphan, Tanaphan, Takenaka, Eiji, Wuttijumnong, VijitYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73278
File:
PDF, 336 KB
english, 2005