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Adhesion Using the Covalent Bond Formation Reaction at the Soft Material Interface
SEKINE, Tomoko, TAKASHIMA, Yoshinori, HASHIDZUME, Akihito, YAMAGUCHI, Hiroyasu, HARADA, AkiraVolume:
72
Year:
2015
Journal:
KOBUNSHI RONBUNSHU
DOI:
10.1295/koron.2015-0040
File:
PDF, 888 KB
2015