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Adhesive wafer bonding with ultra-thin intermediate polymer layers
Bleiker, S.J., Dubois, V., Schröder, S., Stemme, G., Niklaus, F.Volume:
260
Language:
english
Journal:
Sensors and Actuators A: Physical
DOI:
10.1016/j.sna.2017.04.018
Date:
June, 2017
File:
PDF, 1.68 MB
english, 2017