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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging
Han, Yong, Ding, Mian Zhi, Lin, Bu, Choong, Chong SerYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.46
File:
PDF, 597 KB
english, 2016