Fundraising September 15, 2024 – October 1, 2024 About fundraising

Prediction of Electromigration Failure of Solder Joints and...

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Liang, Lihua, Zhang, Yuanxiang, Liu, Yong
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4004658
File:
PDF, 5.15 MB
english, 2011
Conversion to is in progress
Conversion to is failed