Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis
Liang, Lihua, Zhang, Yuanxiang, Liu, YongVolume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4004658
File:
PDF, 5.15 MB
english, 2011