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Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon
Suzuki, Takaaki, Nishino, Yuki, Yan, JiwangLanguage:
english
Journal:
Precision Engineering
DOI:
10.1016/j.precisioneng.2017.04.011
Date:
April, 2017
File:
PDF, 1.62 MB
english, 2017