Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Soldering & Surface Mount Technology 2017 / 06 Vol. 29; Iss. 3

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

zhang, liang, Liu, Zhi-quan, Yang, Fan, Zhong, Su-juan
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Volume:
29
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-07-2016-0015
Date:
June, 2017
File:
PDF, 3.14 MB
english, 2017
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