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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Solder Joint Reliability Investigation of Chip Scale Package with Plastic Core Solder Balls on Thermomechanically Loaded PCBs
Ashtiani, Fama Ghaffari, George, Allen Jose, Heinrich, Thomas, Wolfangel, Simon, Shirangi, Hossein, Klein, ChristianYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.174
File:
PDF, 913 KB
english, 2016