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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Ultra slim packaging and assembly method for 360-μm diameter guide wires
Damalerio, Ramona, Tan, Ee Lim, Tan, Kwan Ling, Lim, Ruiqi, Chen, Weiguo, Cheng, Ming-yuanYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7727915
File:
PDF, 1.97 MB
english, 2015