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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Hermetic Wafer Level Thin Film Packaging for MEMS
Soon, Jeffrey Bo Woon, Singh, Navab, Calayir, Enes, Fedder, Gary K., Piazza, GianlucaYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.317
File:
PDF, 1.17 MB
english, 2016