Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly...

Nanoscale Research Letters 2017 / 12 Vol. 12; Iss. 1

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Li, Junjie, Yu, Xing, Shi, Tielin, Cheng, Chaoliang, Fan, Jinhu, Cheng, Siyi, Liao, Guanglan, Tang, Zirong
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Volume:
12
Language:
english
Journal:
Nanoscale Research Letters
DOI:
10.1186/s11671-017-2037-5
Date:
December, 2017
File:
PDF, 1.02 MB
english, 2017
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