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Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
Darbha, K., Okura, J. H., Shetty, S., Dasgupta, A., Reinikainen, T., Zhu, J., Caers, J. F. J. M.Volume:
121
Year:
1999
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2793846
File:
PDF, 660 KB
english, 1999