Material Constraints and Scaling of 2-D Vertical...

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IEEE Transactions on Electron Devices 2017

Material Constraints and Scaling of 2-D Vertical Heterostructure Interlayer Tunnel Field-Effect Transistors

Campbell, Philip M., Smith, Jake K., Ready, W. Jud, Vogel, Eric M.
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2017.2696827
File:
PDF, 1.18 MB
english, 2017
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