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Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate
Sun, Fenglian, Zhu, Yan, Li, XuemeiVolume:
46
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5344-9
Date:
July, 2017
File:
PDF, 1.02 MB
english, 2017