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[IEEE 2017 18th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2017.3.14-2017.3.15)] 2017 18th International Symposium on Quality Electronic Design (ISQED) - STA compatible backend design flow for TSV-based 3-D ICs
Kalargaris, Harry, Chen, Yi-Chung, Pavlidis, Vasilis F.Year:
2017
Language:
english
DOI:
10.1109/ISQED.2017.7918314
File:
PDF, 381 KB
english, 2017