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[IEEE 2017 18th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2017.3.14-2017.3.15)] 2017 18th International Symposium on Quality Electronic Design (ISQED) - Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs
Furumi, Kaoru, Imai, Masashi, Kurokawa, AtsushiYear:
2017
Language:
english
DOI:
10.1109/ISQED.2017.7918329
File:
PDF, 913 KB
english, 2017