[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Research on the design of mechanical shock test fixture of ceramic package for packaging CCD
Yang, Zhen-tao, Peng, Bo, Gao, LingYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583244
File:
PDF, 839 KB
english, 2016