[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 2 - Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge

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