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Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, ChingpingLanguage:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2017.171
Date:
May, 2017
File:
PDF, 551 KB
english, 2017