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A study on the curing kinetics of epoxy molding compounds with various latent catalysts using differential scanning calorimetry
Lee, Da Eun, Kim, Hyun Woo, Kong, Byung-Seon, Choi, Hyung OukLanguage:
english
Journal:
Journal of Applied Polymer Science
DOI:
10.1002/app.45252
Date:
May, 2017
File:
PDF, 940 KB
english, 2017