![](/img/cover-not-exists.png)
Enhancement of VCSEL performances using localized copper through Silicon vias bonding
TALEB, Fethallah, PES, Salvatore, PARANTHOEN, Cyril, Levallois, Christophe, CHEVALIER, Nicolas, DE SAGAZAN, Olivier, lecorre, Alain, Folliot, Herve, Alouini, MehdiYear:
2017
Language:
english
Journal:
IEEE Photonics Technology Letters
DOI:
10.1109/LPT.2017.2703599
File:
PDF, 270 KB
english, 2017