Effect of Bis-(3-sulfopropyl) Disulfide and Chloride Ions on the Localized Electrochemical Deposition of Copper Microstructures
Wang, Fuliang, Li, Yijie, He, Hu, Wang, Yan, Zhu, Wenhui, Li, JianpingVolume:
164
Year:
2017
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0781707jes
File:
PDF, 870 KB
english, 2017