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Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling
Zając, Piotr, Maj, Cezary, Napieralski, AndrzejLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.04.023
Date:
May, 2017
File:
PDF, 3.40 MB
english, 2017