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[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly
Lofrano, Melina, Cherman, Vladimir, Gonzalez, Mario, Beyne, EricYear:
2017
Language:
english
DOI:
10.1109/EuroSimE.2017.7926236
File:
PDF, 23.46 MB
english, 2017