Adhesive stabilised and pure flip chips on various...

Microsystem Technologies 1995 / 07 Vol. 1; Iss. 3

Adhesive stabilised and pure flip chips on various substrates under thermocycling

S. Rzepka, B. Waidhas, E. Meusel
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Volume:
1
Language:
english
Pages:
8
DOI:
10.1007/bf01294804
Date:
July, 1995
File:
PDF, 1.94 MB
english, 1995
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