[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Analyzing delamination in ASIC packages
Pecanac, G., Silber, C., Kosbi, K., Vollmer, L., Wiedenmann, M., von Bargen, T., Fischer, A.Year:
2017
Language:
english
DOI:
10.1109/EuroSimE.2017.7926219
File:
PDF, 9.25 MB
english, 2017