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[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Packaging effects on Q factor of MEMS resonator
Kisoo Shin,, Do-Hwan Park,, Seungoh Han,Year:
2017
Language:
english
DOI:
10.1109/EuroSimE.2017.7926220
File:
PDF, 8.29 MB
english, 2017